ATS-58001-C1-R0

Advanced Thermal Solutions Inc. ATS-58001-C1-R0

Part No:

ATS-58001-C1-R0

Datasheet:

-

Package:

-

ROHS:

AINNX NO:

2411501-ATS-58001-C1-R0

Description:

ADVANCED THERMAL SOLUTIONS ATS-58001-C1-R0HEAT SINK, MAXIFLOW

Products specifications
  • Factory Lead Time
    6 Weeks
  • Mount
    Adhesive
  • Material
    Aluminium
  • Shape
    Rectangular
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    1 per Pkg
  • Series
    maxiFLOW
  • Published
    2008
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Type
    Heat Sink
  • Color
    Black
  • Depth
    45mm
  • Natural Thermal Resistance
    0.5 °C/W
  • Length
    305mm
  • Width
    87mm
  • Height
    26mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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