Advanced Thermal Solutions Inc. ATS024024020-SF-8S

Material

Aluminum

Shape

Square, Fins

Package Cooled

BGA

Material Finish

Black Anodized

Mfr

Advanced Thermal Solutions Inc.

Fin Height

0.787" (20.00mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Attachment Method

Thermal Tape, Adhesive (Not Included)

Thermal Resistance @ Forced Air Flow

5.12°C/W @ 200 LFM

Length

0.945" (24.00mm)

Width

0.945" (24.00mm)