Advanced Semiconductor Inc BLF246

Mounting Type

Surface Mount

Package / Case

1046-VFBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Supplier Device Package

1046-VFBGA (15x15)

Number of Terminals

4

Transistor Element Material

SILICON

Exterior Housing Material

1

Package

DIL14

Current consumption

40 mA

Rise/fall time

5 ns

Part Life Cycle Code

Active

Ihs Manufacturer

ASI SEMICONDUCTOR INC

Package Description

FLANGE MOUNT, O-CRFM-F4

Drain Current-Max (ID)

13 A

Operating Temperature-Max

150 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Shape

ROUND

Package Style

FLANGE MOUNT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 105°C (TJ)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

ECCN Code

EAR99

Type

Quartz Generator HCMOS/TTL

Terminal Position

RADIAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Depth

20.4 mm

Reach Compliance Code

unknown

Frequency

40000 MHz

Pin Count

a count of all of the component leads (or pins)

4

JESD-30 Code

O-CRFM-F4

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Speed

2GHz, 2.2GHz

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Core Processor

ARM® Cortex®-A55, ARM® Cortex®-A78

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

130 W

Voltage - I/O

1.2V, 1.8V

Ethernet

MII, RGMII, RMII

Number of Cores/Bus Width

4, 4 Core, 64-Bit

Graphics Acceleration

Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

Yes

RAM Controllers

LPDDR4x

USB

USB 2.0 (2), USB 3.1 (2)

Additional Interfaces

I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART

Co-Processors/DSP

ARM® Mali-G57MC5

Security Features

Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

AES, ARM TZ, Boot Security

Display & Interface Controllers

A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

MIPI-CSI

Highest Frequency Band

VERY HIGH FREQUENCY BAND

Height

5.4 mm

Width

12.8 mm