Advanced Semiconductor Inc BLF245

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Mounting Type

Surface Mount

Package / Case

40-VFQFN Exposed Pad

Supplier Device Package

40-QFN (5x5)

Number of Terminals

4

Transistor Element Material

SILICON

Exterior Housing Material

1

Package

DIL14

Rise/fall time

5 ns

Part Life Cycle Code

Active

Ihs Manufacturer

ASI SEMICONDUCTOR INC

Package Description

FLANGE MOUNT, O-CRFM-F4

Drain Current-Max (ID)

6 A

Operating Temperature-Max

150 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Shape

ROUND

Package Style

FLANGE MOUNT

Mfr

Silicon Labs

Series

Flex Gecko

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 125°C (TA)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

ECCN Code

EAR99

Type

TxRx + MCU

Voltage - Supply

1.71V ~ 3.8V

Terminal Position

RADIAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Depth

20.4 mm

Reach Compliance Code

unknown

Frequency

4000 MHz

Pin Count

a count of all of the component leads (or pins)

4

JESD-30 Code

O-CRFM-F4

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

512kB Flash, 32kB RAM

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Protocol

802.15.4

DS Breakdown Voltage-Min

65 V

Power - Output

6dBm

FET Technology

METAL-OXIDE SEMICONDUCTOR

RF Family/Standard

802.15.4

Power Dissipation-Max (Abs)

68 W

Sensitivity

-106.7dBm

Data Rate (Max)

1Mbps

Serial Interfaces

A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

ADC, I2C, I2S, IrDA, SPI, UART, USART

Current - Receiving

3.6mA ~ 4.4mA

Current - Transmitting

4.1mA ~ 8.5mA

Modulation

2-FSK, 4-FSK, 2-GFSK, 4-GFSK, DSSS, GMSK, MSK, OOK, O-QPSK

GPIO

26

Highest Frequency Band

VERY HIGH FREQUENCY BAND

Height

5.4 mm

Width

12.8 mm