ESM-SKLH-6820
PRM4
39553863-ESM-SKLH-6820
6th Gen Intel Core Processor i7/i5/i3 Type6 COMe Basic Module with Intel QM170/CM236 Chipset
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.