Adesto AT25DF011-UUN-T

Package / Case

Axial

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

Axial

Number of Terminals

8

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

1000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

AT25DF011-UUN-T

Clock Frequency-Max (fCLK)

104 MHz

Number of Words

1048576 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Adesto Technologies Corporation

Part Life Cycle Code

Active

Ihs Manufacturer

ADESTO TECHNOLOGIES CORP

Risk Rank

5.77

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-65°C ~ 175°C

Series

Military, MIL-R-10509/1, RN60

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

0.145 Dia x 0.344 L (3.68mm x 8.74mm)

Tolerance

±0.1%

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±50ppm/°C

Resistance

6.9 kOhms

Terminal Finish

Matte Tin (Sn)

Composition

Metal Film

Power (Watts)

0.25W, 1/4W

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.4 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B8

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

--

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

1.65 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

1MX1

Seated Height-Max

0.35 mm

Memory Width

1

Memory Density

1048576 bit

Parallel/Serial

SERIAL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

1.8 V

Features

Flame Retardant Coating, Military, Moisture Resistant, Safety

Height Seated (Max)

--

Width

1.131 mm

Length

1.595 mm