Aavid, Thermal Division of Boyd Corporation 374624B00032G

Factory Lead Time

8 Weeks

Package / Case

BGA

Material

Aluminum

Body Material

Metal

Shape

Square, Pin Fins

Package Cooled

BGA

Material Finish

Black Anodized

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2002

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Top Mount

Color

Black

Depth

35mm

Attachment Method

Thermal Tape, Adhesive (Included)

Height Off Base (Height of Fin)

0.394 10.00mm

Thermal Resistance @ Forced Air Flow

7.60°C/W @ 200 LFM

Thermal Resistance @ Natural

23.40°C/W

Power Dissipation @ Temperature Rise

1.5W @ 40°C

Height

10mm

Length

1.378 35.00mm

Width

1.378 35.00mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free