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AS568-113 EPDM

Aavid AS568-113 EPDM

Part No:

AS568-113 EPDM

Manufacturer:

Datasheet:

Package:

QFN

AINNX NO:

36684842-AS568-113 EPDM

Category:

Bumpers, Feet, Pads, Grips

Description:

ORING,AS568-113,EPDM

Products specifications

Package / Case
QFN
Product Depth (mm)
2(mm)
Operating Temp Range
-20C to 70C
Mounting Styles
Surface Mount
Usage Level
Commercial grade
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk
Pin Count
a count of all of the component leads (or pins)
4
Screening Level
Commercial
Product Length (mm)
1.6(mm)
Product Height (mm)
0.75(mm)

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