3PEAK TPM8837C-DF4R

Mounting Type

Surface Mount

Package / Case

8-UFDFN Exposed Pad

Supplier Device Package

8-DFN (2x2)

Material

aluminium

Type of heatsink

extruded

Heatsink shape

grilled

Material finishing

anodized

Mounting

for back plate

Plate thickness

1.8mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 125°C (TA)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Applications

DC Motors, Relays, Solenoids, Stepper Motors

Voltage - Supply

2.5V ~ 17V

Interface

PWM

Output Configuration

Half Bridge (2)

Voltage - Load

2.5V ~ 17V

Current - Output / Channel

1A

Fault Protection

Protection against electric shock under. single fault conditions.

Current Limiting, ESD, Over Temperature, Short Circuit, UVLO

Rds On (Typ)

850mOhm LS + HS

2nd Connector Number of Positions Loaded

universal

Load Type

Inductive

Length

50mm

Width

33mm

Height

6mm