3M 1000003088

Mount

Surface Mount

Number of Pins

8

Weight

506.605978 mg

Number of Elements

2

RoHS

Compliant

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

40 ns

Brand

3M Electronic Specialty

Manufacturer

3M

Factory Pack QuantityFactory Pack Quantity

1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Digi-Reel®

Resistance

36 mΩ

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-55 °C

Subcategory

EMI/RFI

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

30 W

Number of Channels

2

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

1.1 W

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

7 ns

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

10 ns

Drain to Source Voltage (Vdss)

30 V

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

EMI Gaskets, Sheets & Absorbers

Continuous Drain Current (ID)

16 A

Gate to Source Voltage (Vgs)

20 V

Drain to Source Breakdown Voltage

30 V

Input Capacitance

The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.

435 pF

Drain to Source Resistance

53 mΩ

Rds On Max

24 mΩ

Product Category

a particular group of related products.

EMI Gaskets, Sheets, Absorbers & Shielding

Width

4 mm

Height

1.55 mm

Length

5 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Lead Free

Lead Free